I understand the tempatation, and if it was the only way you found that worked I can definately understand why you’d try and stick with it… but it comes at the expense of situations like this 
this is one of those situations that takes a lot of practice, if you have a scrap unfixable donor board and IC, just repeat this process x20 times, prep the pads, solder the chip, look at it side on and test continuity (from those upper visible contacts on the IC to their desitinations) clean rinse repeat 
you’ll get it in the end. if your still having trouble, try prepping the IC itself also with solder (at a lower than normal temp) prior which will make things easier
I wish I had the the proper camera for my microscope and I’d make proper video tutorials on such subjects, but unfortunately I don’t yet… maybe sometime down the line