Thats the one 
Yes, best practice is to reball anything in which you can’t see the balls from above IE: any BGA IC, and worst case general rule of thumb is reball anything which has > x4 balls otherwise you risk the chip slanting/skewing and shorting higher voltage lines to lower and destroying things elsewhere.
You can reball the IC from a donor with stencils and solder paste - just ensure that the resulting balls are all an even height to one another. Or you may be able to find this chip new preballed or used preballed 
Just be shure to shield the speaker connector during reflow